IEC 60191-5:1997
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IEC 60191-5:1997

IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Summary

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 04/23/1997
Edition 2.0
Page Count 71
EAN ---
ISBN ---
Weight (in grams) ---
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