IEC 60191-6-17:2011
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IEC 60191-6-17:2011

IEC 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Summary

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 01/27/2011
Edition 1.0
Page Count 53
EAN ---
ISBN ---
Weight (in grams) ---
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