IEC 60191-6-19:2010
Active Standard
Most Recent

IEC 60191-6-19:2010

IEC 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Summary

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 02/25/2010
Edition 1.0
Page Count 25
EAN ---
ISBN ---
Weight (in grams) ---
No products.

Previous versions

Contact us