IEC 60191-6-21:2010
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IEC 60191-6-21:2010

IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Summary

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 08/30/2010
Edition 1.0
Page Count 28
EAN ---
ISBN ---
Weight (in grams) ---
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