IEC 60191-6-22:2012
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IEC 60191-6-22:2012

IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Summary

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 12/11/2012
Edition 1.0
Page Count 34
EAN ---
ISBN ---
Weight (in grams) ---
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