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IEC 60512-6-2:2002
IEC 60512-6-2:2002 Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump
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Summary
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/21/2002 |
| Edition | 1.0 |
| Page Count | 9 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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