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IEC 60749-14:2003
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
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Summary
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/07/2003 |
| Edition | 1.0 |
| Page Count | 27 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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