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IEC 60749-16:2003
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
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Summary
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 01/17/2003 |
| Edition | 1.0 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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