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IEC 60749-20:2020
IEC 60749-20:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Summary
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/31/2020 |
| Edition | 3.0 |
| Page Count | 55 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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