Superseded
, Modified
Standard
Historical
IEC 60749-22:2002
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Preview
Summary
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 09/12/2002 |
| Edition | 1.0 |
| Page Count | 41 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
12/09/2002
Superseded
, Modified
Historical