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IEC 60749-35:2006
IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
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Summary
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/18/2006 |
| Edition | 1.0 |
| Page Count | 43 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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