IEC 60749-39:2006
Superseded Standard
Historical

IEC 60749-39:2006

IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Most recent standard

Summary

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 07/24/2006
Edition 1.0
Page Count 19
EAN ---
ISBN ---
Weight (in grams) ---
No products.

Previous versions

Contact us