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IEC 60749-5:2023
IEC 60749-5:2023 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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Summary
IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 12/19/2023 |
| Edition | 3.0 |
| Page Count | 17 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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