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IEC 60749-8:2002

IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Summary

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 08/30/2002
Edition 1.0
Page Count 31
EAN ---
ISBN ---
Weight (in grams) ---
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