IEC 61188-6-1:2021
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IEC 61188-6-1:2021

IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Summary

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 02/23/2021
Edition 1.0
Page Count 63
EAN ---
ISBN ---
Weight (in grams) ---

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