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IEC 61188-6-4:2019
IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
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Summary
IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 05/02/2019 |
| Edition | 1.0 |
| Page Count | 81 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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