IEC 61189-1:1997
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IEC 61189-1:1997

IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Base standard
Most recent standard

Summary

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/27/1997
Edition 1.0
Page Count 37
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ISBN ---
Weight (in grams) ---
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