IEC 61189-2-501:2022
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IEC 61189-2-501:2022

IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Summary

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 02/03/2022
Edition 1.0
Page Count 32
EAN ---
ISBN ---
Weight (in grams) ---
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