IEC 61189-2-803:2023
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IEC 61189-2-803:2023

IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Summary

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 07/26/2023
Edition 1.0
Page Count 16
EAN ---
ISBN ---
Weight (in grams) ---
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