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IEC 61189-2-804:2023
IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
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Summary
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/25/2023 |
| Edition | 1.0 |
| Page Count | 16 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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