IEC 61189-2-807:2021
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IEC 61189-2-807:2021

IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Summary

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 09/03/2021
Edition 1.0
Page Count 17
EAN ---
ISBN ---
Weight (in grams) ---
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