IEC 61189-3-302:2025
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IEC 61189-3-302:2025

IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Summary

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/22/2025
Edition 1.0
Page Count 34
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ISBN ---
Weight (in grams) ---
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