IEC 61189-3-719:2016
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IEC 61189-3-719:2016

IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Summary

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 01/05/2016
Edition 1.0
Page Count 22
EAN ---
ISBN ---
Weight (in grams) ---
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