IEC 61249-8-8:1997
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IEC 61249-8-8:1997

IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Summary

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 06/24/1997
Edition 1.0
Page Count 19
EAN ---
ISBN ---
Weight (in grams) ---
No products.

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