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IEC 62047-16:2015
IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
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Summary
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 µ to 10 µ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/05/2015 |
| Edition | 1.0 |
| Page Count | 21 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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