IEC 62047-25:2016
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IEC 62047-25:2016

IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

Summary

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 08/29/2016
Edition 1.0
Page Count 45
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Weight (in grams) ---
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