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IEC 62374-1:2010
IEC 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
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Summary
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 09/29/2010 |
| Edition | 1.0 |
| Page Count | 32 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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