Active
Standard
Most Recent
IEC 62418:2010
IEC 62418:2010 Semiconductor devices - Metallization stress void test
Preview
Summary
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/22/2010 |
| Edition | 1.0 |
| Page Count | 34 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
22/04/2010
Active
Most Recent