IEC 62739-1:2013
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IEC 62739-1:2013

IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

Summary

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 06/18/2013
Edition 1.0
Page Count 36
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ISBN ---
Weight (in grams) ---
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