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IEC 62769-1:2023
IEC 62769-1:2023 Field Device Integration (FDI®) - Part 1: Overview
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Summary
IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/04/2023 |
| Edition | 3.0 |
| Page Count | 59 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
05/02/2021
Superseded
Historical
Previous versions
04/04/2023
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05/02/2021
Superseded
Historical
12/05/2015
Superseded
Historical