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IEC 62769-8:2023
IEC 62769-8:2023 Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
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Summary
IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/05/2023 |
| Edition | 1.0 |
| Page Count | 105 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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05/04/2023
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