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IEC 62878-2-602:2021

IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Summary

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 06/22/2021
Edition 1.0
Page Count 24
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Weight (in grams) ---
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