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IEC 63378-3:2025
IEC 63378-3:2025 Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
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Summary
IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 05/06/2025 |
| Edition | 1.0 |
| Page Count | 29 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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