Active
Standard
Most Recent
IEC 63378-6:2026
IEC 63378-6:2026 Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
Preview
Summary
IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/04/2026 |
| Edition | 1.0 |
| Page Count | 57 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.