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IEC TR 60286-7:2019
IEC TR 60286-7:2019 Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
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Summary
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/14/2019 |
| Edition | 1.0 |
| Page Count | 24 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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