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IPC 7711/7721D:2023
Rework, Modification and Repair of Electronic Assemblies
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Summary
The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.
Technical characteristics
| Publisher | Association Connecting Electronics Industries (IPC) |
| Publication Date | 01/01/2024 |
| Release Date | 02/06/2024 |
| Edition | D |
| Page Count | 286 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/01/2024
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