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ISO 9453:2014
Soft solder alloys — Chemical compositions and forms
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Summary
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Notes
95.99 : Annulation de la Norme internationale
Technical characteristics
| Publisher | International Organization for Standardization (ISO) |
| Publication Date | 08/18/2014 |
| Edition | 3 |
| Page Count | 16 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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24/09/2020
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