ISO 9455-14:2017 (R2023)
Active , Reaffirmed Standard
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ISO 9455-14:2017 (R2023)

Soft soldering fluxes — Test methods
Part 14: Assessment of tackiness of flux residues

Summary

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Notes

90.93 : Norme internationale confirmée

Technical characteristics

Publisher International Organization for Standardization (ISO)
Publication Date 08/17/2017
Confirmation Date 01/04/2023
Edition 2
Page Count 4
EAN ---
ISBN ---
Weight (in grams) ---
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