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ISO/TS 10303-1685:2018 (R2022)
Industrial automation systems and integration — Product data representation and exchange
Part 1685: Application module: Interconnect module to assembly module relationship
Part 1685: Application module: Interconnect module to assembly module relationship
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Summary
ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship. The following are within the scope of ISO/TS 10303-1685:2018-11: assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;
Notes
90.93 : Norme internationale confirmée
Technical characteristics
| Publisher | International Organization for Standardization (ISO) |
| Publication Date | 12/18/2018 |
| Confirmation Date | 08/04/2022 |
| Edition | 4 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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