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ISO/TS 10303-1689:2018 (R2022)
Industrial automation systems and integration — Product data representation and exchange
Part 1689: Application module: Interconnect physical requirement allocation
Part 1689: Application module: Interconnect physical requirement allocation
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Summary
ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation. The following are within the scope of ISO/TS 10303-1689:2018-11: thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Notes
90.93 : Norme internationale confirmée
Technical characteristics
| Publisher | International Organization for Standardization (ISO) |
| Publication Date | 12/18/2018 |
| Confirmation Date | 08/04/2022 |
| Edition | 5 |
| Page Count | 11 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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