ISO/TS 10303-1754:2010 (R2022)

ISO/TS 10303-1754:2010-03 specifies the application module for Via component. The following are within the scope of ISO/TS 10303-1754:2010-03: blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed; cylinder vias, where the cross-section shape is constant; tapered vias, where the cross-section shape may vary as the vertical distance changes; stacked vias, where multiple bind and buried vias share the same x y position; filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698; buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed; interfacial connections, also known as through hole vias, which have both ends exposed; items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684; items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.