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NF EN 60191-6-3, C96-013-6-3 (04/2001)

Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Summary

Le présent document établit les règles générales de dessin pour les boîtiers plats quadrangulaires (QFP).

Notes

Contenu technique en anglais uniquement

Technical characteristics

Publisher Association Française de Normalisation (AFNOR)
Publication Date 04/01/2001
Release Date 04/01/2001
Page Count 19
Themes Electrotechnologies
EAN ---
ISBN ---
Weight (in grams) ---
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