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NF EN 60191-6-4, C96-013-6-4 (11/2003)
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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Summary
Le présent document concerne les prescriptions des méthodes de mesure des dimensions des boîtiers matriciels à billes.
Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 11/01/2003 |
| Release Date | 11/01/2003 |
| Page Count | 21 |
| Themes | Electrotechnologies |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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