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NF EN IEC 61249-2-51, C93-780-2-51 (06/2023)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-51 : matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
Automatic translation from French :
Materials for printed circuits and other interconnect structures - Part 2-51: Reinforced base materials, plated and unplated - Base materials for integrated circuit card support strip, unplated
Automatic translation from French :
Materials for printed circuits and other interconnect structures - Part 2-51: Reinforced base materials, plated and unplated - Base materials for integrated circuit card support strip, unplated
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Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 06/01/2023 |
| Release Date | 06/01/2023 |
| Page Count | 21 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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