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Historical
PD IEC/TR 60068-3-12:2014
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
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Summary
Electrical components;Environmental testing;Solders;Printed-circuit boards;Solderability testing;Electrical equipment;Thermal testing;Electronic equipment and components;Thermal resistance;Heating tests;Testing conditions;Lead-free alloys
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/17/2014 |
| Cancellation Date | 11/30/2022 |
| Page Count | 20 |
| Themes | Lead-free alloys |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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