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PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering. Guidelines diameter design with solder paste surface printing
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Summary
Components;Electrical components;Circuits;Integrated circuits;Surface mounting devices;Solders
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/31/2022 |
| Page Count | 30 |
| Themes | Solders |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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