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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
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Summary
Assembly;Stress;Testing;Boards;Circuits
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 04/01/2019 |
| Page Count | 16 |
| Themes | Circuits |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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