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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages resistance and thermal parameter of BGA, QFP type
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Summary
Standardization;Semiconductors;Packages;Thermal resistance;Accuracy
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/11/2022 |
| Page Count | 24 |
| Themes | Accuracy |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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