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PR NF EN IEC 60749-20-1, C96-022-20-1PR (11/2023)
Dispositifs à semi-conducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage
Automatic translation from French :
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packaging, labeling and transportation of surface mount components sensitive to the combined effect of humidity and soldering heat
Automatic translation from French :
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packaging, labeling and transportation of surface mount components sensitive to the combined effect of humidity and soldering heat
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Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 11/01/2023 |
| Release Date | 11/01/2023 |
| Page Count | 87 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/07/2009
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01/07/2009
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