Blank detail specification: Microwave modular electronic units of assessed quality - Capability approval; German version EN 160201:1997
€69.91
Packing of components for automatic handling - Part 3: Packing of surface mount components on continous tapes (IEC 40/1433/CD:2004)
€105.42
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/461/CD:2004)
€56.17
Reliability stress screening - Part 3: Reliability screening of repairable single items (IEC 56/951/CD:2004)
€122.34
Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 91/523/CD:2005)
€84.58
Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 91/519/CD:2005)
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 40/2032/CD:2009)
€134.02
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC 107/160/DTS:2011)
€129.53
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan (IEC 107/159/DTS:2011)
€84.49
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
Testing of materials for semiconductor technology - Methods for characterizing photoresists - Part 1: Determination of coating thickness with optical methods
€41.78
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 56/1264/CD:2008)
€195.79
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/777/CD:2008)
€111.40
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints (IEC 91/876/CD:2009)
€150.65
Amendments to IEC 60027-2, 60027-2A, and 60027-2B concerning matrices for linear two-port and n-port networks (IEC 25/214/CDV:1999)
